Application of Lean Six Sigma to Improve Yield Rate of Pressure Switch Process: An Example of K Company

• Main Authors: Chi-Ying Wu, 吳奇穎
• Other Authors: Jhy-Ping Jhang
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/53200785565268143754

碩士 === 華梵大學 === 工業工程與經營資訊學系碩士班 === 100 === The living standards of the human continues climbing for the quality of great importance requirement level is also becoming increasingly stringent. The low-priced and high quality products have made the quality becoming the key factors for enterprise to gain profit or survival. 　　In this study, DMAIC process of Six Sigma combined with the SIPOC Diagram, Pareto Diagram, Failure Mode and Effect Analysis, Cause and Effect Matrix Diagram, T-test, Process Improvement Diagram and other methods improve product process yield. Improvement process is divided into two projects：1. The improvement project for the stability of the product features, we use GAGER&R to test the stability of the equipment, and then use one factor two levels of tensile testing detection to test the differences between Au and Al wire bonding. After changing the material, CPK=1.48 greater than previous CPK=0.65. 2. The improvement project for the reducing price of product, lower product prices improve through Lean Six Sigma techniques to reduce excess waste in the process, CPK=1.40 is greater than previous CPK=0.53.Through the input of main key factors and quality characteristics for the control system, we enhance it process capability, ensure the quality of product, avoid the cost waste of detective products, and achieve the purpose of Six Sigma. Keywords: Lean Six sigma, Wire Bonding, DMAIC, GAGER&R, SIPOC