Effect of interstitial soild solutions on the mechanisms of tribo-electrification

• Main Authors: Sheng-Wen Lai, 賴聖文
• Other Authors: Yuh-Ping Chang
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/74239460518273334787

碩士 === 崑山科技大學 === 機械工程研究所 === 100 === The experiments were conducted on a reciprocating friction tester with a measuring system to investigate the tribological properties of iron or copper sliding against corbon in dry severe wear process. The main parameter was reciprocating speed. Therefore, the effects of interstitial soild solutions on the mechanisms of tribo-electrification can be clarified. According to the dynamic experimental results with the SEM observations of the wear tracks, the variations of tribo-electrification and friction coefficient were significantly influenced by the interstitial soild solutions for the C/Fe pair. However, the above phenomenon was not occurred for the C/Cu pair. On the other hand, the variations of tribo-electrification and friction coefficient were not significantly for the Fe/C pair. This can be explained by the ploughing wear. Moreover, the above variations were also not significantly for the Cu/C pair. Therefore, the method of dynamic monitoring the effect of interstitial soild solutions on the friction and wear by the variations of tribo-electrification and friction coefficient can be successful applied.