A Research of Stress Induced Voiding Improvement at Wide Metal Interconnections in Cu Dual Damascene Process
碩士 === 國立高雄應用科技大學 === 電子工程系 === 100 === Stress Induced Voiding (SIV) is also called Stress Migration (SM) which is one of most important reliability concerns for dual damascene Cu interconnection in the advance circuits. Continuous shrinking the dimensions of interconnections, the void is formed und...
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| Format: | Others |
| Language: | en_US |
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70151681108793824891 |