Effects of 1,10-Phenanthroline on Electroless Copper Deposition
碩士 === 明新科技大學 === 化學工程與材料科技研究所 === 100 === Recently copper has been used to replace Al metallization in ultra large scale integrated (ULSI) technology because of low resistivity and stress-induced voiding. Copper can be deposited by physical vapor deposition, thermal-induced reflow, che...
Main Author: | 劉于瑄 |
---|---|
Other Authors: | 梁世明 |
Format: | Others |
Language: | zh-TW |
Published: |
2011
|
Online Access: | http://ndltd.ncl.edu.tw/handle/85206089767962039063 |
Similar Items
-
Effect of 1,10-phenanthroline on Electroless Copper Deposition
by: Tzu-Yin Chen, et al.
Published: (2005) -
Effects of Polyethyleneimine and 1,10-Phenanthroline on Electroless Copper Deposition
by: CHEN,YAN-TING, et al.
Published: (2016) -
Effects of Polyvinyl alcohol and 1,10-Phenanthroline on Electroless Copper Deposition
by: CHUANG,HAN-JU, et al.
Published: (2013) -
Diaquabis(perchlorato)(1,10-phenanthroline)copper(II)
by: Kamel Kaabi, et al.
Published: (2010-09-01) -
Diaquabis(1,10-phenanthroline)magnesium dichromate(VI) 1,10-phenanthroline disolvate
by: Hai-Xing Liu, et al.
Published: (2009-09-01)