Effects of 1,10-Phenanthroline on Electroless Copper Deposition
碩士 === 明新科技大學 === 化學工程與材料科技研究所 === 100 === Recently copper has been used to replace Al metallization in ultra large scale integrated (ULSI) technology because of low resistivity and stress-induced voiding. Copper can be deposited by physical vapor deposition, thermal-induced reflow, che...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/85206089767962039063 |