Studies and Application of Organic Additives on Microvia Filling of Printed Circuit Boards by Copper Electroplating
博士 === 國立中興大學 === 化學工程學系所 === 100 === Electrolytic copper microvia filling is an enabling technology, prominently used in today’s manufacture of HDI and IC substrates products for better reliability, designed flexibility and thermal management. In this research, the study of how the chemical and phy...
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| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/35731201380567755069 |