Study On Thin TFT-LCD Substrate Scribing Process.

碩士 === 國立中興大學 === 機械工程學系所 === 100 === This study intends to identify appropriate conditions to cut thin TFT-LCD to improve the production. The MPX cutting machines, from MDI company, is adopted in the experiment. The material of glass which is as thin as 0.5mm is ASAHI AN100. The variables of experi...

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Bibliographic Details
Main Authors: Jia-Hsin Liu, 劉佳欣
Other Authors: 戴慶良
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/57104009399112670853
Description
Summary:碩士 === 國立中興大學 === 機械工程學系所 === 100 === This study intends to identify appropriate conditions to cut thin TFT-LCD to improve the production. The MPX cutting machines, from MDI company, is adopted in the experiment. The material of glass which is as thin as 0.5mm is ASAHI AN100. The variables of experiment are cutting pressure, cutting speed, angles of wheel, the number of teeth in cutting wheel. These variables are proved to be important factors to affect the length of vertical crack by hypotheses test. Furthermore, an empirical equation to relate the experiment variables and length of vertical crack is generated by it. This equation is able to estimate the length of vertical crack in alternative conditions. The result reveals that the value of better cutting pressure is from 8.5N to 9.0N. The median length of vertical crack is approximately one-fourth of the value conducted by Tanaka. The better cutting speed is from 250mm/s to 300mm/s. It’s recommended that angles of wheel and the number of teeth in wheel are 110° and 140 number.