| Summary: | 碩士 === 國立成功大學 === 工程科學系專班 === 100 === Moiré interferomety is a reliable method for measuring IC package of deformation. As people today have increasing demands for slim and light electronic products, due to the limitation of the products’ size, it is necessary for the IC to reduce the length and thickness of the silicon. The measurement for IC package body force behavior would be more difficult. Thus, a more accurate phase-shifting technique is developed to illustrate a complete picture of the strain field distribution of the tiny regions. Moiré interferometer has a more than eight times higher accuracy in comparison to the conventional interferomety; it can even reach 52nm. Therefore, the use of moiré interferometry instrument can accurately analyze the IC package body the displacement and strain caused by heat.
As the internal optical path and mechanism of the moiré interferometers currently sold in markets are not clearly revealed, this study focused on the moiré interferometry instruments’ internal optical path, institutional analysis, and design. The analysis of the optical path adopted the grating principle and the law of reflection of light by the laser light source to calculate the light path, the reflection angle, and focus position, depicting the complete light route within the moiré interferometry instrument box. This study also selected a suitable optical holder, mirror, and focusing mirror, and by the mechanical design software, designed and fixed the optical components mentioned above inside the box. In addition, focusing on the shortcoming of the traditional moiré interferometry instrument that specimen plane is fixed in a way that the grating plane cannot be perpendicular to the laser, which resulted in time-consuming corrections, this study redesigned the specimen fixture, and thus significantly reduces the overall measurement time, and efficiently acquires the accurate data.
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