Textural Dependence on Electrochemical Corrosion of Cu electrodeposits for Printed Circuit Boards
碩士 === 國立東華大學 === 材料科學與工程學系 === 100 === Due to excellent electrical and thermal conductivities, Cu foils have been widely applied as the conductive layers of printed circuit boards. Due to the tremendous developments in IC and electronic packaging technologies, the size miniaturization of microelec...
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| Format: | Others |
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2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77kqmu |
| Summary: | 碩士 === 國立東華大學 === 材料科學與工程學系 === 100 === Due to excellent electrical and thermal conductivities, Cu foils have been widely applied as the conductive layers of printed circuit boards. Due to the tremendous developments in IC and electronic packaging technologies, the size miniaturization of microelectronic interconnections has become an important trend. To fulfill the request for conductor patterns with fine pitch and high density, the performance of Cu foils plays an important role. This study selects three kinds of commercial electro-plated Cu foils with different preferred orientations and investigates their microstructural feature and electrochemical behavior in the etching solution (0.5M CuCl2 + 0.5M KCl + 0.5M HCl). Experimental results show that the (220) preferred foils with the finest grains possess superior performance (owest corrosion density and the highest corrosion potential), while the (200) foils with coarse equiaxed grains exhibit different tendency. XPS analytical results indicate that the passive layer is CuCl2, and the corroded products mostly comprise Cu(OH)2 and Cu2O.
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