Textural Dependence on Electrochemical Corrosion of Cu electrodeposits for Printed Circuit Boards
碩士 === 國立東華大學 === 材料科學與工程學系 === 100 === Due to excellent electrical and thermal conductivities, Cu foils have been widely applied as the conductive layers of printed circuit boards. Due to the tremendous developments in IC and electronic packaging technologies, the size miniaturization of microelec...
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| Format: | Others |
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2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77kqmu |