Textural Dependence on Electrochemical Corrosion of Cu electrodeposits for Printed Circuit Boards
碩士 === 國立東華大學 === 材料科學與工程學系 === 100 === Due to excellent electrical and thermal conductivities, Cu foils have been widely applied as the conductive layers of printed circuit boards. Due to the tremendous developments in IC and electronic packaging technologies, the size miniaturization of microelec...
Main Authors: | Yung-Sheng Tsou, 鄒永陞 |
---|---|
Other Authors: | Jian-Yih Wang |
Format: | Others |
Published: |
2012
|
Online Access: | http://ndltd.ncl.edu.tw/handle/77kqmu |
Similar Items
-
Agitation for the electrodeposition of printed circuit boards
by: Amadi, S. A.
Published: (1990) -
Enhanced copper electrodeposition onto printed circuit boards using pulsed current and eductor agitation
by: Ward, Matthew
Published: (1999) -
Corrosion properties of electrodeposited Cu/Co multilayers
by: M. Spilka, et al.
Published: (2021-01-01) -
Analysis and Measurement of Edge Emission Structures on Printed Circuit Board
by: Yung-Chiang Hsieh, et al.
Published: (2004) -
Leaching and Selective Recovery of Cu from Printed Circuit Boards
by: Manivannan Sethurajan, et al.
Published: (2019-09-01)