Effect of chip and molding compound thicknesses on structural stress of multichip module under temperature cycling condition

• Main Authors: Wu, Chun-Liang, 吳俊良
• Other Authors: Lu, Wei-Hua
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/07565478885671596122

碩士 === 國立屏東科技大學 === 材料工程所 === 100 === The material properties, such as coefficient of thermal expansion, glass transition temperature, moisture absorption and elastic modulus, of molding compound and organic substrate are measured using TGA, DSC and TMA. In this study, the elastic three-dimensional finite element models are constructed to simulate the stress and strain distribution of the 4-chips module during the molding compound curing process and the temperature cycling condition. Based on the simulation results, the stresses increase with decreasing the thicknesses of chip and molding compound, and the estimated results of shear strain energy density are less than that of the experimental results. After the reliabitity tests of temperature cycling, high temperature storage and temperature and humidity tests, the module has passed the electrical functional test.