Effect of chip and molding compound thicknesses on structural stress of multichip module under temperature cycling condition
碩士 === 國立屏東科技大學 === 材料工程所 === 100 === The material properties, such as coefficient of thermal expansion, glass transition temperature, moisture absorption and elastic modulus, of molding compound and organic substrate are measured using TGA, DSC and TMA. In this study, the elastic three-dimensional...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/07565478885671596122 |