| Summary: | 博士 === 國立中山大學 === 電機工程學系研究所 === 100 === This dissertation studies and implements highly miniaturized bandpass filter designs for wireless System-in-Package (SiP) applications. Based on the coupling matrix synthesis method, the external quality factors and coupling coefficients can be extracted by selecting the proper tapped-line feeding position and coupling spacing in geometrical configuration. Despite their high performance, most conventional microstrip bandpass filter designs require a bulky area for achieving, making them difficult to implement SiP applications. This dissertation first develops a stacked LC resonator and a stacked spiral resonator (SSR) in an embedded passive substrate (EPS) for realizing miniature single- and multi-band bandpass filters. Moreover, multiple transmission zeros created on both sides of each passband provide high stopband roll-off rates. The designed performance and size are comparable to those of low-temperature co-fired ceramic (LTCC) bandpass filters. As another conventional means of implementing RF passive components, the integrated passive device (IPD) process can produce large-value inductors and high-density capacitors, simultaneously. This dissertation fully utilizes the advantages of IPD technology to implement very compact bandpass filter designs with multiple transmission-zero frequencies at stopband by using a high-density wiring planar transformer configuration. Furthermore, due to the fully symmetric geometry, the transformer-coupled bandpass filter can be easily converted into a balun bandpass filter, capable of providing a superior balance performance with a significantly higher common mode rejection ratio (CMRR) level. The electromagnetic (EM) simulation results, as obtained by using Ansys-Ansoft HFSS, agree with the measurement results for all of the proposed designs in this dissertation.
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