Repair Process Improvement—Surface Mount Technology Line

• Main Author: 吳蕙芬
• Other Authors: 蘇哲平
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/21100059705174055549

碩士 === 國立清華大學 === 工業工程與工程管理學系碩士在職專班 === 100 === The study proposed a process improvement analysis on fail module from SMT (Surface Mount Technology) production line. This paper examines the three major factors comprising the process improvement, repair cost analysis and repair age determination. The first part is the process improvement by fail parts, how to categorize the fail units by different failure mode, and apply the test raw data of CARD test to improve the first repair ratio and reduce the repair cycle time as well. The second parts is to analysis the linkage of repair time and its repair cost, collect the prime cost of rework single module and the increasing rework cost along with repair times, then compare the total cost with its selling price to examine current repair times. The third part is to find out the optimal repair age for single module by the way of decision tress, with its analysis result and it can determine the optima repair age by collecting production record over six months which cover the repair age , amount of rework, repair yield , test yield and repair cost . This proposal provides (1) the way to improve repair yield and reduce the amount of un-rework lots by real case。(2) the way to determine the optima repair age for engineer reference.