The Study of Infrared Brazing Ti50Ni50/CP-Ti and Ti50Ni50/Ti-15-3

碩士 === 國立臺灣大學 === 機械工程學研究所 === 100 === Wetting behavior、microstructural evolution and bonding strength of infrared brazed Ti50Ni50/CP-Ti using Cusil-ABA filler are studied. For brazing at 850℃, many interfacial layers are observed including α-Ti/Ti2Cu eutectoid, Ti2Cu, TiCu, Ti3Cu4, TiCu4, Ag-rich m...

Full description

Bibliographic Details
Main Authors: Kuang-Ting Chien, 簡光廷
Other Authors: Shyi-Kaan Wu
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/17666900940752768241

Similar Items