Study on PCB Competition strategy for HDI Company

• Main Authors: Fang-ching KUO, 郭芳清
• Other Authors: Yi-kuei Lin
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/24662567530251559025

碩士 === 國立臺灣科技大學 === 工業管理系 === 100 === Due to a series of the unpredictable economic changes in the global market, consumers tend to be more conservative. Every manufacturer tried to provide more inexpensive products to stimulate consumers demand in order to boost the market growth. Thus, reasonable-priced products with super value such as netbooks, tablet PCs, low-priced smart phones spring up. Because of the prices of the final products declined, the gross profit of original equipment manufacturers (OEM) and of components factories are suppressed. Printed Circuit Board (PCB) manufacturers have the pressure to cut their prices because of the pressure from PCB average loaded cost reduction. The company in this case uses High Density Interconnection (HDI) as its core technology. HDI can make gaps among PCB components smaller and requires even smaller PCB characteristic size. Thus, the company in this case faces much more severe challenges from the fast market changes and technology advances than the traditional PCB manufacturers do. Because a series of the unpredictable economic changes in the global market,consumers tend to be more conservative. Every manufacturer tried to provide more inexpensive products to stimulate consumers demand in order to boost the market growth. Thus, reasonable-priced products with super value such as netbooks, tablet PCs, low-priced smart phones spring up. Because of the prices of the final products declined, the gross profit of original equipment manufacturers (OEM) and of components factories are suppressed. Printed Circuit Board (PCB) manufacturers have the pressure to cut their prices because of the pressure from PCB average loaded cost reduction. The company in this case uses High Density Interconnection (HDI) as its core technology. HDI can make gaps among PCB components smaller and requires even smaller PCB characteristic size. Thus, the company in this case faces much more severe challenges from the fast market changes and technology advances than the traditional PCB manufacturers do.