Research on Hybrid-Energy Assisted Planarization for Polishing of Hydrolysis LAO Substrates
碩士 === 國立臺灣科技大學 === 機械工程系 === 100 === Chemical mechanical planarization (CMP) has become a popular technology in semiconductor manufacturing process. Substrate of light emitted diode (LED) are usually planarized by the Machano-Chemical Polishing (MCP) proceed due to the solid-phase chemical passivat...
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| Format: | Others |
| Language: | zh-TW |
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2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/j823u4 |