A Study in the Warpage of Tablet PC Front Covers

• Main Authors: Shu-An Huang, 黃仕安
• Other Authors: 韓麗龍
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/y5d29v

碩士 === 國立臺北科技大學 === 製造科技研究所 === 100 === A Tablet PC does not only possess the dexterity and convenience that likes a smartphone, also equips with powerful hardware as a Notebook does. Giving the consideration to hardware function and product appearance, it increases the difficulty of mechanism design. The average thickness of 7 to 10 inches Tablet PC is around 1mm or even thinner. Thus the mold design and injection molding parameter may affects on the product warpage and the finished-dimensional accuracy. In this study, Moldflow analysis software was used to study the warpage and deformation of Tablet PC front cover. First, the noise experiments proceed by using Taguchi method and L8 orthogonal array to find the significant factor. Second, apply L18 inner orthogonal array and L4 outer orthogonal array to find out the optimal injection molding parameters. Through quality characteristics, S/N ratio, and variation analysis, results show the significant factors include the gate number, melt temperature, packing pressure, and cooling time. Using of the optimal parameters, the warpage was improved in compared with the original parameters by CAE analysis. In the actual injection molding products, the warpage in Z-axis direction is also better than original ones.