| Summary: | 碩士 === 國立臺北科技大學 === 製造科技研究所 === 100 === Vapor Chamber is a kind of heat pipe based on the theory of two-phase change thermal conductivity of the cooling system. Compared with the conventional heat pipe, vapor chamber has a high heat transfer capacity and low thermal resistance performance in cooling. The flat evaporator type could be placed on the heat source directly rather than using saddle. Therefore, the vapor chamber has emerged promising development in the application of electronic industry. In this study, we fabricate the Al-alloy vapor chamber using heat transfer theory. Meanwhile, we investigate the influence of varied surface modification processing and various water contents on the performance of vapor chamber. Firstly, the inner Cu thin film of vapor chamber was modified by using sputtering and electroplating, and further discusses the impact of various water contents on performance. Depending on the results, we could optimize the modification processing and analyze the performance.
In this research, we investigated the effect of thin films on the performance of Al-alloy vapor chamber. We find that the reaction layers strongly affect thermal conductivity after diffusion bonding of films, and it deeply improves the performance by barring Al diffusion. In the discussion of vapor chambers’ thermal resistivity, we find that the cooling efficiency using electroplating is much better than sputtering. Varying the water contents, the results show that the 100% water content injection has the lowest thermal resistance of 0.344 ℃ /W. On the other hand, the vapor chambers using electroplating thermal have speedy thermal response compared with Al bulk and copper bulk, even faster than Cu film sputtered vapor chambers.
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