| Summary: | 碩士 === 國防大學理工學院 === 化學工程碩士班 === 101 === Preparation of metal lines or patterns on flexible PET and PI substrates were studied in this thesis. The optical grade PET substrate having light-transmissible property and low cost is a good material for optical applications. PI is a polymer with high smoothness, excellent chemical resistance, high temperature resistance and low coefficient of expansion, which is good for application of the substrates of electronic devices. In this thesis, our typical catalytic ink containing palladium (Pd) nano-particles was used to print lines or patterns on the PET and PI substrates with ink-jet printing. These substrates were then electroless plated with nickel (Ni) to form metallic lines or patterns. Since the whole process was completed at lower temperature and was low cost, it is superior to the traditional method of metallization on nonconductive substrates.
Using silane as the coupling agent to modify PET and PI substrates and increase their adhesion with plated Ni layer was studied. In contrast to the traditional dry plasma pretreatment, this study attempts to use environment-friendly pickling solution to do the pre-processing of the substrate to improve the self-assembly reaction between silane coupling agent and substrate. The influence of process parameters such as the concentration of silane coupling agent and the reaction time on the degree of surface modification of the substrate was evaluated to find the optimal process parameters for the best adhesion between metallic pattern and substrate. The silane-modified surface of substrates were analyzed with contact angle measurements and FTIR spectroscopy to evaluated their modification effect.
The results show that our typical ink-jet printing and electroless plating process can successfully deposit 6.1 μm and 12.8 μm Ni layer on PET substrates respectively according to different ways of PET modification. The adhesion between Ni layer and substrate passed the 5B degree of ASTM-d3359 test. The resistivity of the deposited Ni film was about 6.67 × 10-7 Ωm. As for the PI substrates, the deposited Ni layer can achieve 3.9 μm for different modification methods. The adhesion between Ni layer and substrate also passed the 5B degree of ASTM-d3359 test. These results indicate that the metallic patterns fabricated with our typical ink-jet printing and electroless plating method has potential for the application of flexible electronic devices.
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