Thermal Conductivity of Poly (Ethylene-co-Vinyl Acetate)-Based Hot Melt Adhesives

• Main Authors: Hsiao-Ching Shih, 施曉清
• Other Authors: Fu-San Yen
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/19311403340544230770

碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系碩士在職專班 === 101 === This research uses the EVA hot melt adhesive obtained by adding tackifier in the Ethylene-Vinyl Acetate Copolymer (EVA) with a different content of vinyl acetate (VA),specifically, 19,28,33wt%, and then mixing in and melting a similar percentage (50wt%) of high-thermal-conductivity inorganic powder (Al2O3, SiO2 and SiC) to make EVA thermally conductive adhesive. It discusses the impacts of thermal conductivity and other physical properties of thermally conductive adhesives when EVA hot melt adhesive with a different content of VA is blended with a different inorganic powder and solidified. In terms of thermal property, the Differential Scanning Calorimeter (DSC) was used to measure the thermal change, and the Thermo gravimetric analyzer (TGA) to determine the thermal degradation temperature. In terms of thermal conductivity property, the Hot-Disk test was conducted to measure the thermal conductivity. In order to analyze the structural changes, the Scanning Electron Microscope (SEM) was used to observe the surface change of inorganic powder in EVA hot melt adhesives. As for the physical property, the tensile strength test, hardness test, etc. were carried out to discuss the mechanical properties and thermal stability. From the results, we learn that the TGA test shows that the heat resistance can be improved by blending inorganic powder in EVA hot melt adhesive with a different content of VA. After conducting the Hot-Disk test, the coefficient of heat conduction of the EVA hot melt adhesive without blending inorganic powder is about 0.25W/m.K. However, after mixing in a similar percentage of Al2O3, SiO2 and SiC, the coefficients of heat conduction of the EVA hot melt adhesive are 1.19W/m.K, 0.94W/m.K and 1.5W/m.K, respectively. The experimental data shows that the coefficient of heat conduction of the EVA hot melt adhesive is improved by blending inorganic powder in the EVA hot melt adhesive with a different content of VA.