Effects of Polyvinyl alcohol and 1,10-Phenanthroline on Electroless Copper Deposition

• Main Authors: CHUANG,HAN-JU, 莊翰儒
• Other Authors: Shyh-Min Liang
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/43800799590598348383

碩士 === 明新科技大學 === 化學工程與材料科技系碩士班 === 101 === Electroless plating is also known as autocatalyticplating or chemical plating. It stands for the process that depositing metal on substrate from metal ion solution by chemical reduction instead of electric power. The superiority of electroless plating is that low void fraction, more anti-etching than electroplated film, good abrasion resistance, good adhesion, uniform plated metal, easy to operate and can be applied to non-conductive substrate. This process widely applied to ultra large-scale integration (ULSI) and cooper-plating process of integrated circuit fabrication in recent decades. Also, the electroless cooper plating getting more and more attentions due to seldom stress crack and good conductivity of cooper. The images of SEM show that samples fabricated with plating solution which contained 100 ppm of PVA and 30ppm of 1,10-Phenanthroline hydrate have the best flatness and fastest deposition rate. The resistance, sheet resistance and resistivity measured by four-point probes is 0.108398 mΩ, 0.491259 mΩ/cm2 and 0.0019μΩ-cm respectively, it’s also lower than other samples fabricated with plating solution which contained different concentration of PVA and 1,10-Phenanthroline hydrate. Results of X-ray diffraction analysis show that crystalline phase of deposited metal are 222 phase. Cross-cut test show that the adhesion force between deposited metal and substrate is 3B in ASTM class.