| Summary: | 碩士 === 國立成功大學 === 機械工程學系碩博士班 === 101 === One important issue of the ultrathin glass in the R2R processing is to reduce its fragility, which is mainly caused by the ragged edge. Recently, an ingenious CO2 laser peeling technique for removing the edge defects of ultrathin glass substrates has been developed by ITRI. In order to fully understanding the fundamental mechanism of laser peeling, a theoretical model is developed to predict the temperature distribution, cooling rate, heat affected depth and peeling depth within the substrate given known values of the laser power (34 W), laser frequency (10 kHz), laser spot size (150 μm) and laser ablation pitch (50 μm). The theoretical results for the heat affected depth and peeling depth are compared with the experimental results observed by optical microscopy (OM). It is found that the theoretical results for the 1500 K envelope are in good agreement with the experimental heat affected depth, while those for the 770 K envelope are in good agreement with the peeling depth. In addition, it is found that the peeling mechanism is enhanced as the cooling rate increases. In general, the results confirm that the proposed analytical model provides a suitable tool for understanding and optimizing the laser peeling process in the R2R processing of ultrathin glass substrates.
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