Tearing off and bonding semiconductors

• Main Authors: Sheng-Han Xie, 謝昇翰
• Other Authors: Ming-Kwei Lee
• Format: Others
• Language: en_US
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/hhet4e

碩士 === 國立中山大學 === 電機工程學系研究所 === 101 === Silicon solar cell made from thin-film crystalline-silicon layers on glass substrates could lower the price of photovoltaic electricity substantially. For this reason, a considerable number of methods have been proposed in the last decade to manufacture thin silicon foils which aim to replace the commonly used sawing technique. One of these methods ”SLiM-Cut” is based on peeling off a thin layer from a silicon substrate by means of the thermal stress induced by layers deposited on the silicon. Up to now, three different materials which are used to be deposited layers have been successfully employed in this technique: Nickel, Nickel/Chromium alloy and a Silver/Aluminium system. In this work we invent the possibility to induce the lift-off of a thin silicon solar cell foil by means of smearing small region Ag paste on top of the solar cell. This new method has low cost and lowers the operating temperatures.