Applying TRIZ on Improvement of Process Reliability Test

• Main Authors: CHEN, CHIEN FU, 陳建福
• Other Authors: Hwang, Sheue Ling
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/34686904103376630090

碩士 === 國立清華大學 === 工業工程與工程管理學系碩士在職專班 === 101 === Process reliability test, it's very difficult to achieve timeline for many products’ tests simultaneously because of the limitation of the machine capacity. As a result, it will cause serious demand conflicts. The purpose of this study is to improve the process reliability test methods to shorten the test time and speed up the feedback of test result with the same quality. In this study, two problem solving concepts, which are forward and backward thinking, were combined in TRIZ analysis processing. By forward thinking of TRIZ analysis processing, we applied “Function Attribute Analysis (FAA)” to build a Function-Attribute system. After analyzing the functional conflicts of system and contradict parameters by “Cause-Effect & Contradiction Chain Analysis (CECCA)”, we followed “Contradiction Matrix and Invention Principle” to find out the trigger solutions and generate the specific solutions. Then by backward thinking of TRIZ analysis processing, “Trends of Engineering System Evolution (TESE)” was used to set up the goal of system by improvement. The system’s ultimate goal was achieved by “Ideally Final Result/Analysis”, and the idealities from the ultimate goal were reduced by “Trimming” to find the solutions. Finally, we adjusted the property of solutions to get an appropriate solution with brainstorming and “Function-Oriented Search (FOS)”. This study is the forerunner on practically applying TRIZ methodology in problem solving by combining the forward and backward thinking, and the first one to apply TRIZ in process reliability test improvement field. The result indicated that we could get effective and efficient solution by this kind of TRIZ methodology. After TRIZ analysis, we get a final solution to replace "Package Level Reliability Electro-Migration (PLR-EM)" with "Wafer Level Reliability Isothermal Electro-Migration (WLR-IsoEM)", and to overcome the testing conflicts. It not only shortens the test time for approximately 1000 times and speeds up the feedback of test result, but also save necessary package required time and cost of process reliability test to improve the performance of system.