| Summary: | 碩士 === 國立臺灣大學 === 機械工程學研究所 === 101 === Finite element analysis is frequently employed by researchers to investigate the mechanics and/or thermal behaviors of high-power light emitting diodes (LED). Unfortunately, after performing finite element analysis, only a few people continue to discuss the life and reliability of the LED. In the present study, a relationship between the junction temperature and the life of a LED is established first based on real test data. Finite element analysis is then employed to find the junction temperature of the LED. Afterwards, the life of the module is predicted based on the relationship mentioned above. To account for possible uncertainties, parameters such as the heat transfer coefficient and the photoelectric conversion efficiency are considered random variables. Monte Carlo method for simulating samples of these random variables is employed in the finite element analysis and life prediction of the LED. An amount of lives indicating a random sample out of the studied LED are obtained, even under the same temperature and environmental condition. Statistical analysis is finally employed to find the life distribution and reliability of the LED. The result is very important to both LED manufacturers and consumers.
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