Warpage Analysis of the Notebook Front Bezel (B part)

碩士 === 國立臺北科技大學 === 製造科技研究所 === 101 === The external plastic parts of notebook screen is composed by the front bezel and the back cover. If the warpages of these two parts are too large, that will cause poor appearance after assembling. In this study, Moldex3D software was used for analyzing the fro...

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Bibliographic Details
Main Authors: Jhon-Sing Liu, 劉宗鑫
Other Authors: 韓麗龍
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/xejz23
Description
Summary:碩士 === 國立臺北科技大學 === 製造科技研究所 === 101 === The external plastic parts of notebook screen is composed by the front bezel and the back cover. If the warpages of these two parts are too large, that will cause poor appearance after assembling. In this study, Moldex3D software was used for analyzing the front bezel of notebook (having eight gates). First, altering the diameter of gate to improve the melt flow balance, then applied Taguchi Method with L8 orthogonal array to find the important compound noise factors, and then applied L18 to execute the main experiments. Secondly, analysis of variance was used to test the important factors and to find the optimal parameter combination for reducing the warpage. Finally, the confirmation experiment and the confidence intervals were applied to assure that whether the predicted value and experiment value is close enough. The results showed that suitable gate design can improve the melt flow balance in the cavity and reduce the warpage. By adjusting the filling time and melt temperature, the pressure distribution in the product will be more even. The significant factors affect the S/N are the packing time, the packing pressure, the melt temperature, and the gate size. Furthermore, the confirmation experiment showed that the predicted value and the experiment value is very close to 95% confident level. That is, the empirical model is as accurate as expected.