Studies on interfacial reactions of lead-free solder joints and electroless deposited diffusion barriers in the Bi2Te3-based thermoelectric system
碩士 === 國立中正大學 === 化學工程研究所 === 102 === Thermoelectric (TE) devices consist of many pairs of p- and n-type semiconductor elements, which are interconnected electrically by soldering technology. Bi2Te3-based alloys are the most popular thermoelectric materials. Sb and Se are usually alloyed to Bi2Te3-b...
Main Authors: | Chun-Wei Chiu, 邱俊暐 |
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Other Authors: | Chao-Hong Wang |
Format: | Others |
Language: | zh-TW |
Published: |
2014
|
Online Access: | http://ndltd.ncl.edu.tw/handle/632yph |
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