| Summary: | 碩士 === 中原大學 === 工業與系統工程研究所 === 102 === As the 3C products and the traditional household appliances have become more electronic, the use of the printed circuit board has also increased tremendously. Generally, printed circuit boards are referred to as PCB (Printed Circuit Board) or PWB (Printed Wiring board), which is the basic electronic component in the industry and has been used in 3C products such as electronic watches, cell phones, computers, etc., even in military weapons, communication equipment, and space shuttles. The applications of PCB can be found everywhere in our lives.
In the consumer market, the product evolution trends toward lighter, thinner, smaller, and smarter. In order to make electronic devices with high density and miniaturization, the printed circuit board is used to carry electronic components and must also contains finer circuit lines and spaces. Meanwhile, the micro via technology is also used to further miniaturize the whole design. With the development of its active and negative components, PCB obviously becomes smaller. High density PCB has great requirements for its functional characteristics, so the accuracy and precision of electric test should be improved. Besides, to reduce defects after assembly, PCB manufacturer also need more precise test method.
This research is based on the sensing process of every layer interconnection board in high-ends products that produced by one of the factories under the well-known print circuit board manufacturer in Taiwan. It indicated the use and the capability of four-terminal sensing technology in order to improve the sensing results. Also, detailed functional error detecting system has been processed. The values of electrical resistance have been inspected based on the sampling of mass produced circuit board and verified through experiment and slide/slice examination. At the same time, it found appropriate four-terminal sensing standard to detect micro-functional error items with the consideration of the possible inspection costs, inspection risks and the yield loss. This test method can not only sense the error that was not possible to be identified by the traditional two-terminal sensing, but also lower the possibility of risk with some cost increased.
The study result showed that two-terminal sensing did exist possible sensing risks. Although the use of four-terminal sensing increased the cost and produced some yield loss, it did improve the ability in sensing to prevent micro-functional errors. This would hugely reduce the external cost due to quality failures.
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