| Summary: | 碩士 === 朝陽科技大學 === 應用化學系 === 102 === In this study, the microencapsulated phase change materials (MicroPCMs), were prepared by suspension polymerization. The shell was made of the methyl methacrylate-vinylsilane copolymer, and the core was paraffin. Moreover, aluminum nitride (AlN) and aluminum oxide (Al2O3) were incorporated to the shell to bring highly thermal conductive and large latent heat- MicroPCMs The result shows that the diameters of MicroPCMs were around 3.2-11.3 μm, and were decreased with the increasing concentration of stabilizer (Polyvinyl alcohol). As for the thermal conductivity of the shell, the aluminum oxide and aluminum nitride containing MicroPCMs are 0.7151 and 1.0518 W/m‧k, respectively. The paraffin contents are 70.2% and 72.8%, respectively. After thermal cycling of 50 times, both MicroPCMs still keep excellent stability. TGA results show that the decomposition temperatures of both MicroPCMs were higher than 200℃. The test on a battery module shows that aluminum nitride containing MicroPCM can improve the heat dissipation by more than 22%. On the basis of these results, such MicroPCMs show good potentials for thermal energy storage.
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