Adhesion Strength Improvement of Copper Coating on Aluminum Nitride by Interlayer
博士 === 逢甲大學 === 材料科學與工程學系 === 102 === Recently metal-ceramic composite materials have been widely used in microelectronics, light-emitting diodes, and 3D IC. This study focused on the total-wet metallization of aluminum nitride by direct plated nickel alloys for further direct plated copper. Prepara...
Main Authors: | Hsien-Ta Hsu, 徐先達 |
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Other Authors: | Tsong-Jen Yang |
Format: | Others |
Language: | zh-TW |
Published: |
2013
|
Online Access: | http://ndltd.ncl.edu.tw/handle/xcbsyv |
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