Adhesion Strength Improvement of Copper Coating on Aluminum Nitride by Interlayer
博士 === 逢甲大學 === 材料科學與工程學系 === 102 === Recently metal-ceramic composite materials have been widely used in microelectronics, light-emitting diodes, and 3D IC. This study focused on the total-wet metallization of aluminum nitride by direct plated nickel alloys for further direct plated copper. Prepara...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/xcbsyv |