A Study of Wafer Expanding Adapter design using TRIZ theory

• Main Authors: Tsai, Ming-Lang, 蔡敏郎
• Other Authors: Huang, Ying-Fang
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/ygemsh

碩士 === 國立高雄應用科技大學 === 工業工程與管理系碩士班 === 102 === Abstract In the fierce competition of semiconductor industry, enhancing technique and yield accompanies loss decrease is a chasing goal. At the period of sample run or pilot run, manually manufacturing product is a common way, which will lead to unstable yield and high cost. In that case, customer may lack faith for mass production. This thesis mainly researches the feasibility of different frame ring size workable on current Wafer Expander by designing a Wafer Expanding Adapter to reduce manual steps and material waste during new devices sample run and pilot run. In this study, aiming at transferring wafer on various size frame ring to uniform frame ring, applying “Contradiction Matrix”, “39 parameters”, “40 invention principles” to search the relatedness of each parameter and the possible solutions, then proceed systematical research to Wafer Expander by “substance-field analysis” and solving rule、”76 standard solutions” to look for optimal design of Wafer Expander, which will obtain quality and yield improvements during Wafer Mount process. From actual operation, Wafer Expander can work smoothly by applying TRIZ which improved the leading time of transferring GaAs wafer to 8” frame ring, and UPH of die bonder increased from 864ea to 1890ea, yield of Die Bond stage raised from 95% to 99.9%. It proved Wafer Expanding Adapter by applying TRIZ acquired tremendous benefit of quality and cost.