A study of polyvinyl alcohol for acid copper deposition

• Main Authors: LIN,CHENG-HUA, 林鄭華
• Other Authors: LIANG,SHYH MING
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/47580340058109044211

碩士 === 明新科技大學 === 化學工程與材料科技系碩士班 === 102 === The purpose of this experiment is to develop a suitable additive to instead ofpolyethylene Glycol (PEG) in acid copper sulfate bath.By using kinds of preciseinstrument to research the effect of Polyvinyl Alcohol (PVA) on the plating rate, surface morphology, crystal structure, element analysis, and resisivityof copper deposition. Electrochemical impedance spectroscopy (EIS) results are interpreted with regard to experimental studies for copper deposition in the presence of PVA and Cl-. The conclusion is that Polyvinyl Alcohol(PVA) has the lower charge transfer resistance, by increasing PVA concentration to make copper plates crystal growth direction from (111) to (220) and the crystal size of the copper plates become smaller obviously. SO PVA has the the quality of smooth to reduce porosity.