Carbon Footprint Assessment and Verification of Wafer Probing
碩士 === 明新科技大學 === 工業工程與管理系碩士班 === 102 === Over the last decades, anthropogenic greenhouse gas (GHG) emissions have come to be accepted as the main cause of climate change. To find and implement GHG mitigation strategies, international efforts during this period have been devoted to quantifying the m...
Main Authors: | , |
---|---|
Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2014
|
Online Access: | http://ndltd.ncl.edu.tw/handle/47631991586241415288 |
id |
ndltd-TW-102MHIT0117003 |
---|---|
record_format |
oai_dc |
spelling |
ndltd-TW-102MHIT01170032016-02-21T04:21:12Z http://ndltd.ncl.edu.tw/handle/47631991586241415288 Carbon Footprint Assessment and Verification of Wafer Probing 晶圓測試碳足跡評估及查證 Hua Yu Tseng 曾華煜 碩士 明新科技大學 工業工程與管理系碩士班 102 Over the last decades, anthropogenic greenhouse gas (GHG) emissions have come to be accepted as the main cause of climate change. To find and implement GHG mitigation strategies, international efforts during this period have been devoted to quantifying the main GHG and identifying their sources. Semiconductor industry possesses the characteristics of complex supply chain, long cycle time, and high level of energy consumption. Facing the issues of climate change, energy conservation and carbon reduction, to promote the competitiveness of companies and fulfill the duty of members of global village, companies proactively undertaking GHG inventory should be treated as an important index of business strategy. This study proposes a two-stage research structure. In the first stage, the standards of ISO/TS 14067 and carbon footprint (CFP) guide of Environmental Protection Administration (EPA) are used to investigate the required principles and methods to assess CFP of wafer probing. Based on the relevant standards, the CFP of wafer probing is gained. In the second stage, the CFP results are internally verified based on the standards of ISO 14040/14044 and CFP verification guide of EPA. The flaws of CFP assessment identified in the process of verification can be used as the reference for future’s assessment operations. A real wafer probing factory is used as case study and the wafer type with the majority of probing demand is chosen to assess the CFP of wafer probing. The functional unit of target product is 25 wafers per lot. Based on the results of the case study, the CFP of wafer probing is 759.83Kg CO2e per lot. Among them, the GHG emission of energy is 758.79Kg CO2e (99.86% of total GHG emission). By reviewing the GHG emissions of energy, it can be found that the GHG emission of purchased electricity is 758.23Kg CO2e (99.79% of total GHG emission). Therefore, purchased electricity is the major GHG emitter of the CFP of wafer probing. The second stage of this study is CFP verification. A group from members of environment and security department of the case company is formed to internally verify the key points of verification. Verification results show that all the key points meet the relevant standards. 呂博裕 2014 學位論文 ; thesis 83 zh-TW |
collection |
NDLTD |
language |
zh-TW |
format |
Others
|
sources |
NDLTD |
description |
碩士 === 明新科技大學 === 工業工程與管理系碩士班 === 102 === Over the last decades, anthropogenic greenhouse gas (GHG) emissions have come to be accepted as the main cause of climate change. To find and implement GHG mitigation strategies, international efforts during this period have been devoted to quantifying the main GHG and identifying their sources. Semiconductor industry possesses the characteristics of complex supply chain, long cycle time, and high level of energy consumption. Facing the issues of climate change, energy conservation and carbon reduction, to promote the competitiveness of companies and fulfill the duty of members of global village, companies proactively undertaking GHG inventory should be treated as an important index of business strategy. This study proposes a two-stage research structure. In the first stage, the standards of ISO/TS 14067 and carbon footprint (CFP) guide of Environmental Protection Administration (EPA) are used to investigate the required principles and methods to assess CFP of wafer probing. Based on the relevant standards, the CFP of wafer probing is gained. In the second stage, the CFP results are internally verified based on the standards of ISO 14040/14044 and CFP verification guide of EPA. The flaws of CFP assessment identified in the process of verification can be used as the reference for future’s assessment operations. A real wafer probing factory is used as case study and the wafer type with the majority of probing demand is chosen to assess the CFP of wafer probing. The functional unit of target product is 25 wafers per lot. Based on the results of the case study, the CFP of wafer probing is 759.83Kg CO2e per lot. Among them, the GHG emission of energy is 758.79Kg CO2e (99.86% of total GHG emission). By reviewing the GHG emissions of energy, it can be found that the GHG emission of purchased electricity is 758.23Kg CO2e (99.79% of total GHG emission). Therefore, purchased electricity is the major GHG emitter of the CFP of wafer probing. The second stage of this study is CFP verification. A group from members of environment and security department of the case company is formed to internally verify the key points of verification. Verification results show that all the key points meet the relevant standards.
|
author2 |
呂博裕 |
author_facet |
呂博裕 Hua Yu Tseng 曾華煜 |
author |
Hua Yu Tseng 曾華煜 |
spellingShingle |
Hua Yu Tseng 曾華煜 Carbon Footprint Assessment and Verification of Wafer Probing |
author_sort |
Hua Yu Tseng |
title |
Carbon Footprint Assessment and Verification of Wafer Probing |
title_short |
Carbon Footprint Assessment and Verification of Wafer Probing |
title_full |
Carbon Footprint Assessment and Verification of Wafer Probing |
title_fullStr |
Carbon Footprint Assessment and Verification of Wafer Probing |
title_full_unstemmed |
Carbon Footprint Assessment and Verification of Wafer Probing |
title_sort |
carbon footprint assessment and verification of wafer probing |
publishDate |
2014 |
url |
http://ndltd.ncl.edu.tw/handle/47631991586241415288 |
work_keys_str_mv |
AT huayutseng carbonfootprintassessmentandverificationofwaferprobing AT cénghuáyù carbonfootprintassessmentandverificationofwaferprobing AT huayutseng jīngyuáncèshìtànzújīpínggūjícházhèng AT cénghuáyù jīngyuáncèshìtànzújīpínggūjícházhèng |
_version_ |
1718193414934102016 |