| Summary: | 碩士 === 明志科技大學 === 工業工程與管理系碩士班 === 102 === Integrated circuit (IC) design industry is thriving in Taiwan. Under specialization and division of work, downstream IC assembly factories still have high growth potential. Because IC assembly industry varies from minute to minute, to promote product quality and industry competitiveness, IC assembly factories all try to take actions on the control of assembly process yield in order to build latest IC assembly process and create high value-added products to increase customer satisfaction. One of the important things is that the stress caused by die bond step of IC assembly process may lead to chip/die deformation and, futher, make the sensitivity and offset of triaxial (3-aix) accelerometer fail.
Therefore, this research applies the DMAIC analysis method of Six-Sigma (6σ) to solve the stress issue of triaxial (3-aix) accelerometer caused by die bond step of IC assembly process. The D (Define) stage first collects the opinions from end-customers and analyzes the returned product issues. Next, the M (Measure) stage measures the process capability via the repeatability and reproducibility analysis of equipment for the basis of the following process improvement. The A (Analyze) stage uses the cause & effect matrix to identify the possible impact factors of stress. The I (Improve) stage applies the design of experiment (DOE) method to identify the optimal design of impact factors and ensure the improvement effect. Finally, the C (Control) stage uses the control chart to monitor the following experimental results. Furthermore, this research applies the research approach to IC assembly process of micro electro-mechanical system (MEMS). The result shows that the yield rate of the process increases about 1.15%.
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