The development of tool condition and cutting quality monitoring in PZT/Si wafer micro milling by Neural Network and AE signal
碩士 === 國立中興大學 === 機械工程學系所 === 102 === Micro-mechanical machining holds the advantage of machining complex feature in micro scale with various types of material and draws much more attention recently due to the increase demand in micro device with various types of material. However, the high tool...
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ndltd-TW-102NCHU53110412017-10-15T04:36:37Z http://ndltd.ncl.edu.tw/handle/05055167633364193711 The development of tool condition and cutting quality monitoring in PZT/Si wafer micro milling by Neural Network and AE signal 應用類神經網路與聲射訊號於鋯鈦酸鉛/矽晶圓微銑削刀具狀態與切削品質監測系統開發 Ling-Fang Chang 張齡方 碩士 國立中興大學 機械工程學系所 102 Micro-mechanical machining holds the advantage of machining complex feature in micro scale with various types of material and draws much more attention recently due to the increase demand in micro device with various types of material. However, the high tool wear rate in machining brittle material such as silicon and PZT limits its application in mass production. The development of tool wear and surface quality monitoring in machining PZT/Si wafer with the diamond thin film deposited micro mill was focused in this study. The system includes the acoustic emission signal collection, feature selection, and classification models. The class-mean scatter criteria were used in the feature selection, and the back propagation neural network was used for the classifier design. In order to collect the data for the system development and verification, an experiment was conducted on a PMC micro machining center with the diamond film deposited micro mill. In machining, the AE signal and cutting force was collected and analyzed for the delamination of the diamond thin film from tool and tool wear, as well as the quality change on the bottom surface of machined slot. The results show that the close relationship between the AE signal and the tool condition was confirmed, as well as the surface quality of machined slot. With the proper selection of features and number of training samples, higher than 94% classification rate can be obtained for the film delamination and tool wear with the developed system in machining the PZT/Si wafer with the thin film deposited micro tool. Moreover, 100% classification rate can be obtained for the quality monitoring. Ming-Chyuan Lu 盧銘詮 2014 學位論文 ; thesis 96 zh-TW |
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碩士 === 國立中興大學 === 機械工程學系所 === 102 === Micro-mechanical machining holds the advantage of machining complex feature in micro scale with various types of material and draws much more attention recently due to the increase demand in micro device with various types of material. However, the high tool wear rate in machining brittle material such as silicon and PZT limits its application in mass production.
The development of tool wear and surface quality monitoring in machining PZT/Si wafer with the diamond thin film deposited micro mill was focused in this study. The system includes the acoustic emission signal collection, feature selection, and classification models. The class-mean scatter criteria were used in the feature selection, and the back propagation neural network was used for the classifier design. In order to collect the data for the system development and verification, an experiment was conducted on a PMC micro machining center with the diamond film deposited micro mill. In machining, the AE signal and cutting force was collected and analyzed for the delamination of the diamond thin film from tool and tool wear, as well as the quality change on the bottom surface of machined slot.
The results show that the close relationship between the AE signal and the tool condition was confirmed, as well as the surface quality of machined slot. With the proper selection of features and number of training samples, higher than 94% classification rate can be obtained for the film delamination and tool wear with the developed system in machining the PZT/Si wafer with the thin film deposited micro tool. Moreover, 100% classification rate can be obtained for the quality monitoring.
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Ming-Chyuan Lu |
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Ming-Chyuan Lu Ling-Fang Chang 張齡方 |
author |
Ling-Fang Chang 張齡方 |
spellingShingle |
Ling-Fang Chang 張齡方 The development of tool condition and cutting quality monitoring in PZT/Si wafer micro milling by Neural Network and AE signal |
author_sort |
Ling-Fang Chang |
title |
The development of tool condition and cutting quality monitoring in PZT/Si wafer micro milling by Neural Network and AE signal |
title_short |
The development of tool condition and cutting quality monitoring in PZT/Si wafer micro milling by Neural Network and AE signal |
title_full |
The development of tool condition and cutting quality monitoring in PZT/Si wafer micro milling by Neural Network and AE signal |
title_fullStr |
The development of tool condition and cutting quality monitoring in PZT/Si wafer micro milling by Neural Network and AE signal |
title_full_unstemmed |
The development of tool condition and cutting quality monitoring in PZT/Si wafer micro milling by Neural Network and AE signal |
title_sort |
development of tool condition and cutting quality monitoring in pzt/si wafer micro milling by neural network and ae signal |
publishDate |
2014 |
url |
http://ndltd.ncl.edu.tw/handle/05055167633364193711 |
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