On-Interposer Data Communication for 2.5D Heterogeneously Integrated Bio-Sensing Microsystems
碩士 === 國立交通大學 === 電子工程學系 電子研究所 === 102 === 2.5D integration allow to inter-chip communication between multiple chips with intra-chip interconnects. The interposer provides fast and low power chip-to-chip communication. In this thesis, an on-interposer bus (μ-SPI, serial peripheral interface) is pr...
Main Authors: | Lin, Yu-Rou, 林毓柔 |
---|---|
Other Authors: | Chuang, Ching-Te |
Format: | Others |
Language: | en_US |
Published: |
2013
|
Online Access: | http://ndltd.ncl.edu.tw/handle/95703399464979168233 |
Similar Items
-
Testing of Interposer-Based 2.5D Integrated Circuits
by: Wang, Ran
Published: (2016) -
Timing Characteristic Extraction Methodology for 2.5D Interposer Integrate System
by: Chang,Yan-Bin, et al.
Published: (2016) -
The Study of Thermal Behavior of 2.5D Package with Embedded Interposer
by: JHENG, YUAN-JYUN, et al.
Published: (2014) -
Heterogeneous System Level Integration Using Active Si Interposer
by: Vivek Chidambaram, et al.
Published: (2019-01-01) -
Timing aware testing and repair for interposer wires in 2.5-D IC
by: Lee, Jeo-Yen, et al.
Published: (2013)