| Summary: | 碩士 === 國立交通大學 === 機械工程系所 === 102 === Along four sides of monitor screens, COFs have to be bonded. The so called gantry robot is a high precision outer lead bonding equipment. Gantry robots are commonly used in the bonding operation after IC packaging in panel industry and semiconductor industry. During the bonding process, bonder moving and bonding movement result in vibration and misalignment to IC pins. To ensure the bonding stability of gantry robots in high precision and as a basis to improve mechanical design, in this research, bonding models were first constructed and sent to ANSYS Workbench software to carry out the finite element analysis. Static structure simulation is carried out to compute the deformation of components when four bonders move to different positions. This study uses natural frequencies and mode shapes from modal analysis to characterize the dynamic response of the gantry robot. The mode superposition method sums 40 mode shapes for calculating dynamic response. In experiments, laser displacement sensors are used to measure vibration behavior of the gantry robot. The obtained results were used to set up a reliable finite element model. In this study, a design of bonders based on the results of vibration analysis has been proposed. It is shown that the proposed design performs well and provides engineers improvement and references in designing the gantry robot.
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