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碩士 === 國立中央大學 === 化學工程與材料工程學系 === 102 === The flux has been widely used for soldering in the electronic package, since the flux can effectively remove the oxidation layer of the molten solder and ensure a good wetting during the reflow process. However, after the reflow process, the residual flux w...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13762874521291673822 |