Optimal Parameter Design Of Double COG Manufacturing Process

• Main Authors: Ching-wei Yang, 楊謦維
• Other Authors: None
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/89616624000048620145

碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 102 === In conformity with the intersection of mould and the intersection of group and goal that factory can move towards low cost, high yield gradually, make at the material Cheng changing to some extent too, already by the original flexible circuit board (Chip-Of-Film, COF) )Change into Chip IC, want, overcome variation at the material, cause, make unstable parameter Cheng, there are unstable skew phenomena after originally pressing, so in COG (Chip-Of-Glass) It makes have Cheng to be relevant to make ability Cheng, need to make and further improve, in order to improve the degree of stability at products quality. And its main research of a thesis focuses on studying Chip IC degree of stability pressed skew quantity after jointing, for use the intersection of field and the intersection of mouth and method on development of parameter Cheng of making first method not used, and then utilize reacting the law of curved surface do the discussion of the optimization block of parameter, by meeting the best parameter association of the multiple quality characteristic. By the above-mentioned two kinds of research approaches, put Chip IC in order out and make the best parameter of X axle and Y axle skew quantity up, produce quantity examine result that come out, make Cheng control (Statistical Process Control, SPC) through count through actual quantity To prove the association type of its parameter of optimization can improve the degree of stability of Chip IC skew quantity.