Integrated Analysis of Life Cycle Assessment With Carbon Footprint：Cases Study of Semiconductor Assembly Industry

• Main Authors: CHEN-HUA WU, 吳貞樺
• Other Authors: Lei yang
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/8fjr38

碩士 === 國立中山大學 === 海洋環境及工程學系研究所 === 102 === This thesis, with the application of life cycle assessment, is meant to understand how the carbon footprint of an IC package product originates. Thus, its result will help reduce or improve the carbon footprint of the product. The Life Cycle Inventory Analysis data include “energy, resources, major materials, auxiliary materials, package material and waste” and transportation data in above items. They also include GHG data, in compliance with PAS 2050 and IC-PCR. A functional unit is an IC product with a Flip Chip package. After the data based on rationality were examined, the SimaPro software was used to calculate the life cycle assessment and environmental impact to complete the carbon footprint assessment of the product. The percent of the carbon footprint of the analyzed Flip Chip IC was up to 83.36 %, whose die was provided by the wafer manufacturer. Judging from the outcome, to reduce the carbon footprint is in the main to cut down on that of wafer. However, when the carbon footprint of the die was not taken into account, in the process of the semiconductor assembly, the carbon footprint mainly originated from the "Substrate", which was up to 49.0192%, and that of the electricity used in the packaging process was 44.5113%. It reasons that when a Flip Chip IC package is assembled, raw material suppliers must be required to reduce the carbon footprint of their products, which is more effective to be in demand on Substrate, and that much needed is energy saving in the assembly process.