Floorplanning and Signal Assignment for Silicon Interposer-based 3D ICs
碩士 === 國立清華大學 === 資訊工程學系 === 102 === Since the implementation of 3D ICs is problematic, interposer-based 3D ICs (or known as 2.5D ICs), using a silicon interposer as an interface between a package and dies, has been seen as an alternative approach to 3D ICs. In a 2.5D IC, the floorplan of dies on th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18725294621657450344 |