Novel Through-Silicon Via (TSV) Technology and Application on Nano-Electronics Devices
碩士 === 國立臺南大學 === 電機工程學系碩博士班 === 102 === In this thesis, one novel TSV fabrication method is proposed. This new process can reduce two step of process compared to the conventional one. In addition, this process does not require the carrier wafer thus the removal issue can be avoided. The novel TSV f...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/93095776095821636929 |