| Summary: | 碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 102 === EMC(Epoxy Molding Compound) is a highly integrated frame type used in molding packaging process which adopts new epoxy material and substrate etching techniques. In the process of formation, since the glue would leak out during the high temperature and pressure bonding process between substrate and epoxy, without historical data to refer to the de-flash process could only depend on the engineer to set various parameter according to frame type and density.
Nowadays as the turnover rate of employee becomes high which makes it difficult to pass down experience, also due to product quality deviates in a wide range and the gradually increased demand on precision, the process parameter setting could not rely on engineer’s experience and instinct for a long term operation. Therefore, this research proposed a progressive methodology of orthogonal array focusing on the test design plan combining both de-flash parameter design and error tolerance design in order to find out the optimum process parameter combination which has the advantage of high efficiency, convenience and cost effective as well as achieving the requirement of quality and yield improvement during the semi-finished product period.
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