The Research of Surface Mount Technology in 3C Product's PCB Fabrication

• Main Authors: Fu-mi Yeh, 葉福明
• Other Authors: Linda wu
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/97827057660877464971

碩士 === 世新大學 === 資訊傳播學研究所(含碩專班) === 102 === Currently electronic industry is in a highly competition situation. The profit of electronic product is in a very low level. Since, the production yield rate is more important of product profit, day by day. Many electronic companies are pay large amounts of resources for improve production technique and management skill to enhance the profit margin. An electronic product manufacture process can divide to parts as SMT, DIP, Function test, Assembly and Packing. Each part has individual production technology and verification method. The paper approach by separate the manufacturing process to several parts and find out major problem that come from production issue, then using daily check method to calibrate the equipment in advance for make sure the data accuracy. Judge it by expert experience and propose the solution to improve the manufacturing technique. At last, use X-ray to confirm the soldering performance of each pad. The difference to evaluate the problem by statistics analysis is it can fine out each problem hide in production process and let the key variability factor and long term defeat factor appear. That helps us easier to analyze layer by layer and description line by line. The perform and verify condition of experiment is controlled by research condition, ambient temperature check and visual inspection of material packing. In a controllable condition, we try to vary some of factor in the experiment and count and analysis the evaluate and observe results to get production related issue that evidences the problems are come from production parameter setting, and the result can help to prevent problem in advance.