| Summary: | 碩士 === 國立臺北科技大學 === 機電整合研究所 === 102 === 3C products have been designed toward thinner and tiny scale as a result of attracting more attention of consumers. Thus, the improved efficiency of heat dissipation for electronic devices a difficult challenge. Vapor chamber is one kind of cooling system using theory of changed thermal conductivity from two-phase, which is based on heat pipe. This two-phase component consists of a wick structure which is inside the vacuum chamber wall; using the working fluid evaporation and condensation characteristic to speed up the thermal transmission. In this study, we fabricate the thin vapor chamber with using different vapor flow channel width, and different shapes of sintered copper powder inside the cavity of the evaporation area, to investigate the impact on performance of the vapor chamber.
For this research, we use 0.6 mm thickness as the vapor space height. Preparation of 2, 4, 6 mm vapor flow channel width and different wick shape in evaporation area of the vapor chamber. Compare with normal vapor chamber and copper to detection performance. The result in different flow channel width test shows that w6 VC has a minimum resistance 0.194 ΔT/W at 100 W. In hybrids wick test, The cross groove VC has 0.186 ΔT/W resistance at 100 W. This study successfully improved the thin vapor chamber’s high heat resistance problem.
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