Analysis and Verification for USB3.0 Platform Noise and Transmission distance

• Main Authors: Wei-Feng Lin, 林暐峰
• Other Authors: 施鴻源
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/87099020507599950753

碩士 === 淡江大學 === 電機工程學系碩士在職專班 === 102 === In today’s consumer electronic products, the speed and performance of electronic components are continuously to be enhanced and the demand for computer’s mobility, portability and lightweight is increased; however, many emission source products are placed in relatively small space that causes mutual interference, especially the built-in antennas, which is even more easily impacted by the internal system’s noise and hence the performance of wireless communication is affected. This study mainly focus on the high frequency noise generated by connection between the terminal of Universal Serial Bus 3.0 and USB3.0 mobile storage products, which couples the noise to nearby wireless frequency band via conduction coupling or radiation emission, and affects the data transmission rate of wireless communication. Therefore, we constructed a set of diagnostic methods and analysis flows to deal with the noise generated during the reconnection of Universal Serial Bus 3.0. As for the issue of WLAN communication interference, we first use the built-in antennas the test the Platform Noise, then we verify the source of interference and interference path by electric and magnetic field measurement. At last, we increase the WLAN data Throughput by 50%by changing the position of the antenna.