Analysis of Via Hole Effects on Printed Circuit Board High Definition Multimedia Interface Electromagnetic Interference

• Main Authors: Wei-Ming Chiu, 邱唯銘
• Other Authors: 劉寅春
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/91332915205930336799

碩士 === 淡江大學 === 電機工程學系碩士在職專班 === 102 === The High-Definition Multimedia Interface (HDMI) becomes more and more common in current 3C products, such as Notebook, Ultra book, all-in-one PC (AIO), Tablet PC. Even a mobile phone may have HDMI Port. In such a complex system, the electromagnetic interference (EMI) of HDMI signal on printed circuit board (PCB) is always one of the difficult issues for an EMC engineer. This thesis focus on the layout of through vias of HDMI signal routing which analyzes the impacts of EMI and compares differences of EMI and the signal impedance matching. Two different layouts of HDMI signal routing of PCB in an all-in-one PC will be designed for comparing the differences between the HDMI signal routing with four vias (through vias) and signal routing with two vias (through vias) in a 6-layer motherboard. Using spectrum analyzer with near-field measurement to observe the EMI radiation intensity, and then use three meters of non-reflective chamber to measure the differences between 4 vias and 2 vias of EMI in frequency 30MHz to 1GHz. This experiment also uses Time Domain Reflectometer (TDR) to measure the impedance matching of HDMI signal routing and analyze the relationship between the EMI radiation intensity and the impedance matching of signal line.