| Summary: | 碩士 === 逢甲大學 === 工業工程與系統管理學系 === 103 === In recent years, the electronics industry continued rapid development of technology, customer also upgrade the requirement for consumer electronics, making the design of electronic products continue to small size,high performance, and low cost to develop. Under such conditions and trends, in terms of semiconductor package industry , the selection process capability or material will be big challenge!
In the IC packaging, wire bonding process is often used gold wire to connect the chip and the substrate/lead frame, and build the bridge for electrical signal transmission. Wire bonding process in semiconductor package industry which is the main bottleneck site.To study break the bottleneck station, and to improve equipment reliability. It use Cause-and-Effect diagram to improve MTBF in this paper. Then for material(such as wafer, capillary(bonding wire), substrate to strengthen inspection,etc),machine(fine tune pameters,follow SPEC rules, clean room environment requirements,etc),man(preventive maintenance implementation, strengthen education and training, etc.),method(tools clean. measuring machine correction).The action can increase equipment output and to improve the bottleneck equipment utilization of semiconductor package, reduce production losses and lifting equipment properly degrees.By MTBF Lifting can monitor the relation to MTBF and OEE (Overall Equipment Effectiveness; OEE). The results of this study show the level of MTBF which with the machine utilization rate significantly positive correlation. The equipment utilization is an important factor in OEE,so utilization rate fluctuations can affect the level of OEE.
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