Oxidation and Plasma Modification Affecting the Wettability of UBM-Al Layer with Lead Free Solder
碩士 === 逢甲大學 === 化學工程學系 === 103 === In the flip-chip technique, tin-lead bumps (Solder Bumping) and the carrier plate made of two parts is the most critical. Carrier is a flip chip technology accounted for the highest cost of a raw material, usually accounting for 4-5 percent or so of material costs....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/31754713359451046084 |