Laser line-etching and cutting techniques for glass substrates

• Main Authors: Yan-An Chan, 陳彥安
• Other Authors: Chwan-Huei Tsai
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/05755051130840240384

碩士 === 華梵大學 === 機電工程學系 === 103 === The aim of this paper is to propose the alternative techniques of laser line-etching and cutting for glass substrates. An Nd:YAG laser is applied to the backside of the glass which is submerged in water. A metal plate is placed below the glass substrate. Most of the laser energy will be absorbed by the metal plate. The metal then vaporizes the water and generates a turbulent bubble flow. A rectangular nozzle whose inlet and outlet are narrow rectangular shape is proposed to enhance the impact of the bubble jet. The jet impact can be divided into two types of bubble jet and steam jet. The parameters of laser power, repetition rate, and the scanning speed were obtained. It was found that slowing the laser scanning can enhance the etching width. When the laser power is higher, the etching width is larger. The proposed line-etching technique was also applied in laser cutting of glass. The bubble jet induced from the rectangular nozzle is used to generate a groove along the cutting path. The glass substrate is separated by applying a CO2 laser beam along the etched groove to drive the groove through the thickness of the glass. The etched groove can enhance the cutting speed and determine the direction of crack propagation. A three-point-bending device was performed to enhance the breaking speed. For the laser repetition rate of 3 KHz, laser power of 50 W, and the laser scanning speed of 1 mm/s, the best etching quality was obtained which made the breaking surface free from any defect in the following cutting process.